About Us

eTopus is an innovator and technology leader in high performance, DSP-based, mixed-signal, ultra-high speed semiconductor interconnect solutions

eTopus designs ultra-high speed mixed-signal semiconductor solutions for high-performance computing and data center applications. Our ultra-high speed SerDes IP is adopted by global Tier-1 players to be used in networking, storage, 5G, and AI applications.

eTopus was the first startup to demonstrate ADC/DSP-based SerDes at 56Gbps supporting the emerging PAM-4 standards as early as 2016. Our innovation in ADC/DSP-based physical layer transceiver technology delivers superior Bit Error Rate performance for Long Reach applications at low power consumption. The system architecture has been proven and matured over multiple generations of silicon.

Team

Founded eTopus and secured $10M funding from leading VCs such as SK Telecom Ventures, and Cross-border funds, including Hong-Kong-X Platform, Brizan since 2012.

20+ years experience in Engineering, Operations, Business Development, Sales &
Marketing in Silicon Valley.

Holder of 20 patents

Harry Chan

Founder & CEO

20+ years experience in Systems Architecture & Digital Signal Processing in Silicon Valley. World-renowned expert in Error Control Coding; landmark paper (1,000+ citations) published in IEEE journals & conferences; ~50 patents granted or pending

Peter Kou, PhD

Co-Founder & CTO

25+ years experience in developing analog mixed-signal and RF integrated circuit
products for Communications and Storage applications in Silicon Valley Has published papers in IEEE conferences & journals including International Solid State
Conference; 10 patents granted or pending

Danfeng Xu

Co-Founder & VP, Analog

25+ years of finance and accounting experience with various management roles in
companies with different sizes from start up to Fortune 500 companies Broad knowledge in accounting and finance, including acquisition and integration, new business models, international accounting, and SOX compliance

Nancy Hsu

CFO (CPA)

40+ years experience in IC design and CAD engineering Responsible for all 28/16/7/22nm PDK, CAD tools, layout, automation, and IT servers Has participated in all R&D programs and customer layout delivery

Larry Moser

Senior CAD Director

25+ years experience in all aspects of digital design Led team and participated in all major R&D development Responsible for managing SoC integration for customer projects Holds 2 US patents

Paul Lai

VP, Digital Design

10+ years industrial program management experience with particular background in
human centered design includes human-computer interface, consumer products, and industrial products Expert in applying User Experience (UX) strategy to design workflow and operations to drive continuous improvement and manage change into standard best practices

Emily Au, PhD

Operations Director

25+ years experience in both start-ups (Berkäna Wireless co-founder) and large technology companies (GM/executive at Intel and Qualcomm) Proven track record partnering with customers, defining products, leading engineering teams in silicon, hardware, software, and systems, and bringing to market innovative solutions delivering value to customers and the enterprise

Cormac S.G. Conroy, PhD

Advisor