eTopus is exhibiting at the
TSMC 2023 Open Innovation Platform Ecosystem Forum

Thanks TSMC, for organizing the highly successful 2023 TSMC OIP Forum for semiconductor innovators to share the latest developments from technology leaders.

We are delighted to have participated in this meaningful event to showcase our solutions for the future Chiplet Market. We emphasized our experience in overcoming key design challenges on two different types of channels, including a prototype of an active electrical cable over a 3m copper cable and a Proof of Concept (POC) for an active optical cable over 100m OM4 multimode fiber. Please feel free to reach out to us (info@etopus.com) directly to discuss how we can support your next project.