Come join us to see our 112G ePHYTM SerDes IP Demos at DesignCon 2021
August 10, 2021
DesignCon 2021 – North America’s largest chip, board, and systems event is just around the corner! This event brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of tomorrow and we are excited to be a part of it! Visit our booth (#531) to learn more, network, and grab some swag!
DATE: August 17 – 18, 2021
Location: San Jose McEnery Convention Center
eTopus will demonstrate its revolutionary ePHY SerDes IP:
- 112G ePHY SerDes: Providing a scalable and adaptable solution to bridge the fastest systems with the fastest networks
- 112G Extra-long reach: Capable of equalizing 40dB+ channel attenuation
- 112G High density interface: Delivering robust performance through Hirose IT-NG (next-gen) mezzanine connector and enabling CPU/GPU/TPU-module base high bandwidth network solutions
If you want to learn more about our company and the demos we are showcasing, please reach out to us directly at event.info@etopus.com.
Interested in registering? For more information please visit the event website here: https://na.eventscloud.com/ereg/newreg.php?eventid=567704
Band with our reinvented I/O to unleash network bandwidth for you! Hope to see you at our Booth #531 in DesignCon!
Sincerely,
Harry Chan（陈继强）
创始人兼首席执行官
