Happy Thanksgiving! Share this post Recent Post eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined Read More eTopus 112G High Scalability SerDes Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More Load More
eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns San Jose, CA – October 19, 2021 eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications is proud to introduce its new 400G Long Range (LR) IP solution incorporating Forward Error Correction (FEC) IP and the eTopus DSP-based …
eTopus Extra Long Reach https://etopus.com/wp-content/uploads/2022/06/vid-2-chinies-trans.mp4 Share this post Recent Post Thank you for visiting us at DesignCon 2022 Read More Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for Read More eTopus Announces PCIe IP Gen 1-6 and 800G Support for 7/6nm with Support Read More Load More
eTopus High Density Interface https://etopus.com/wp-content/uploads/2022/06/3rd-booth-chinies-trans-rev.mp4 Share this post Recent Post Thank you for visiting us at DesignCon 2022 Read More Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for Read More eTopus Announces PCIe IP Gen 1-6 and 800G Support for 7/6nm with Support Read More Load More
Happy Mid-autumn Festival! Share this post Recent Post eTopus 112G High Scalability SerDes Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Read More Load More
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications https://etopus.com/wp-content/uploads/2021/09/HirosePR_DRLeaderboard.mp4 Complete bench setup using Hirose mezzanine connectors and eTopus SerDes IP was demonstrated at DesignCon in San Jose San Jose, CA – August 17, 2021 Hirose Electric Co., Ltd., a global leader in connector technology, its design, and manufacturing, …
Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Sept 14, 2021 San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today …
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications https://etopus.com/wp-content/uploads/2021/09/HirosePR_DR.mp4 Complete bench setup using Hirose mezzanine connectors and eTopus SerDes IP was demonstrated at DesignCon in San Jose San Jose, CA – August 17, 2021 Hirose Electric Co., Ltd., a global leader in connector technology, its design, and manufacturing, …
eTopus 112G High Scalability SerDes https://etopus.com/wp-content/uploads/2021/09/booth-1-chinies-trans.mp4 Share this post Recent Post Happy Mid-autumn Festival! Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Read More Load More
Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Sept 14, 2021 San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today …