Congratulations to eTopus Team Presenting at 2022 TSMC OIP October 27, 2022 Thanks TSMC for organizing a very successful 2022 TSMC OIP Forum for semiconductor innovators to see and share the latest development from the technology leaders. Our R&D team partnered with Siemens EDA team to highlight the experience of overcoming key design challenges …
Congratulations to eTopus Team Presenting at 2022 TSMC OIP Read More »
Thank you for visiting us at DesignCon 2022 April 15, 2022 Thanks for visiting our booth and chatting with us at DesignCon 2022. Our team appreciated and enjoyed the opportunity to demo our PCIe and 112G Ethernet solution. Please checkout the press release regarding our demonstration of the Hirose mezzanine/card edge connectors and eTopus SerDes IP. …
Happy Lunar New Year 2022! Share this post Recent Post Happy Thanksgiving! Read More eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined Read More Happy Mid-autumn Festival! Read More Load More
Happy Holidays! https://etopus.com/wp-content/uploads/2021/12/HappyHolidays2021.mp4 Share this post Recent Post Happy Thanksgiving! Read More eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined Read More Happy Mid-autumn Festival! Read More Load More
Happy Thanksgiving! Share this post Recent Post eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined Read More eTopus 112G High Scalability SerDes Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More Load More
Happy Mid-autumn Festival! Share this post Recent Post eTopus 112G High Scalability SerDes Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Read More Load More
Thank you for visiting us at DesignCon 2021 August 19, 2021 Thanks for visiting our booth and chatting with us at DesignCon 2021. Our team appreciated and enjoyed the opportunity to demo our leading-edge 112G ePHYTM SerDes IP solutions to you. Please checkout the press release regarding our demonstration of the Hirose mezzanine interconnects with our 112Gbps …
Come join us to see our 112G ePHYTM SerDes IP Demos at DesignCon 2021 August 10, 2021 DesignCon 2021 – North America’s largest chip, board, and systems event is just around the corner! This event brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of …
Come join us to see our 112G ePHYTM SerDes IP demos at DesignCon 2021 Read More »
Showcasing 112G ePHYTM SerDes IP at DesignCon 2021 July 23, 2021 DesignCon 2021 is just around the corner – North America’s largest chip, board and systems event. This three-day event brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of tomorrow. Visit eTopus’ booth (#531) at the …
Showcasing 112G ePHYTM SerDes IP at DesignCon 2021 Read More »
eTopus Technology Demo at ISSCC 2021 Wrap-up February 23, 2021 Last Friday at ISSCC 2021 we have successfully demonstrated our scalable adaptive ADC/DSP-based 1.25-to-56Gbps/112Gbps high-speed transceiver architecture using Decision-Directed MMSE approach. This system architecture can support a wide range of the data rates at different channel losses with wide temperature variation. Here is the video …