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Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications https://etopus.com/wp-content/uploads/2021/09/HirosePR_DRLeaderboard.mp4 Complete bench setup using Hirose mezzanine connectors and eTopus SerDes IP was demonstrated at DesignCon in San Jose   San Jose, CA – August 17, 2021   Hirose Electric Co., Ltd., a global leader in connector technology, its design, and manufacturing, …

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Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Sept 14, 2021  San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today …

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Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications https://etopus.com/wp-content/uploads/2021/09/HirosePR_DR.mp4 Complete bench setup using Hirose mezzanine connectors and eTopus SerDes IP was demonstrated at DesignCon in San Jose   San Jose, CA – August 17, 2021   Hirose Electric Co., Ltd., a global leader in connector technology, its design, and manufacturing, …

Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications Read More »