eTopus 112G High Scalability SerDes https://etopus.com/wp-content/uploads/2021/09/booth-1-chinies-trans.mp4 Share this post Recent Post Happy Mid-autumn Festival! Read More Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Read More eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Read More Load More
Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Sept 14, 2021 San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today …
eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Breakthrough Software and Methodology Enables Fast and Insightful IC Design Debugging and Optimization San Jose, CA – August 24, 2021 Diakopto announced today that eTopus, a pioneer of ultra-high speed ADC/DSP-based SerDes for wireline applications, has chosen the ParagonX platform and methodology for integrated circuits …
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Thank you for visiting us at DesignCon 2021 August 19, 2021 Thanks for visiting our booth and chatting with us at DesignCon 2021. Our team appreciated and enjoyed the opportunity to demo our leading-edge 112G ePHYTM SerDes IP solutions to you. Please checkout the press release regarding our demonstration of the Hirose mezzanine interconnects with our 112Gbps …
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications Complete bench setup using Hirose mezzanine connectors and eTopus SerDes IP will be demonstrated at DesignCon in San Jose San Jose, CA – August 17, 2021 Hirose Electric Co., Ltd., a global leader in connector technology, its design, and manufacturing, …
Come join us to see our 112G ePHYTM SerDes IP Demos at DesignCon 2021 August 10, 2021 DesignCon 2021 – North America’s largest chip, board, and systems event is just around the corner! This event brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of …
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Showcasing 112G ePHYTM SerDes IP at DesignCon 2021 July 23, 2021 DesignCon 2021 is just around the corner – North America’s largest chip, board and systems event. This three-day event brings together the brightest minds across the high-speed communications and semiconductor industries who are looking to engineer the technology of tomorrow. Visit eTopus’ booth (#531) at the …
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eTopus Technology Demo at ISSCC 2021 Wrap-up February 23, 2021 Last Friday at ISSCC 2021 we have successfully demonstrated our scalable adaptive ADC/DSP-based 1.25-to-56Gbps/112Gbps high-speed transceiver architecture using Decision-Directed MMSE approach. This system architecture can support a wide range of the data rates at different channel losses with wide temperature variation. Here is the video …
eTopus Technology Demo Video at ISSCC 2021 https://etopus.com/wp-content/uploads/2021/02/demo-01.06.2020-v5-compressed.mp4 Share this post Recent Post Thank you for visiting us at DesignCon 2022 Read More Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for Read More eTopus Announces PCIe IP Gen 1-6 and 800G Support for 7/6nm with Support Read More Load More
Don’t miss eTopus Technology Demonstration at ISSCC! February 16, 2021 Today we’ve successfully presented our paper, “A Scalable Adaptive ADC/DSP-Based 1.25-to-56Gbps/112Gbps High-Speed Transceiver Architecture Using Decision-Directed MMSE CDR in 16nm and 7nm” . If you’ve missed the presentation, it’s available online (registration is required). Our Demonstration is scheduled as below: Who: Mr. Danfeng Xu & …
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