Leo Chong

eTopus announces partnership with YorChip for Low Latency 200G Chiplet

新闻稿 / 作者：

eTopus announces partnership with YorChip for Low Latency 200G Chiplet. YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps. SAN RAMON, CA, USA, June 19, 2024 — YorChip, Inc. announces its first Chiplet details to empower edge AI developers. The Chiplet …

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TSMC OIP conference 2023

Blogs / 作者：

eTopus is exhibiting at theTSMC 2023 Open Innovation Platform Ecosystem Forum September 27, 2023 Thanks TSMC, for organizing the highly successful 2023 TSMC OIP Forum for semiconductor innovators to share the latest developments from technology leaders. We are delighted to have participated in this meaningful event to showcase our solutions for the future Chiplet Market. …

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Join us at Supercomputing 2022 in Dallas

Blogs / 作者：

Join us at Supercomputing 2022 in Dallas Come and learn more about eTopus revolutionary UCIe ChipliPHY™️ products November 9, 2022 Superomputing 2022 – Our world is changing rapidly. Complex challenges are suddenly arising alongside an urgent demand for answers. Leveraging HPC, skilled minds employ innovative technologies to respond to the call — driven by data, …

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Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity

新闻稿 / 作者：

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet Applications to Achieve Compliance and High-Speed Connectivity Tewksbury, MA., June 21, 2022 Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP solution partner for eTopus PCIe Gen 1-6 …

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity Read More »

QuickLogic and eTopus Announce Disaggregated Flexible eFPGA Chiplet Template

新闻稿 / 作者：

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template Targeting advanced, high-performance applications | Available initially as configurable IP and later as Known Good Die chiplets SAN JOSE, Calif., June 16, 2022 QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader …

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Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications

新闻稿 / 作者：

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications Complete bench setup using Hirose mezzanine/card edge connectors and eTopus SerDes IP will be demonstrated at DesignCon in San Jose San Jose, Calif. – April 6, 2022 Hirose Electric Co., Ltd., a global leader in connector technology, its design, …

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