Leo Chong

TSMC OIP conference 2023

eTopus is exhibiting at theTSMC 2023 Open Innovation Platform Ecosystem Forum September 27, 2023 Thanks TSMC, for organizing the highly successful 2023 TSMC OIP Forum for semiconductor innovators to share the latest developments from technology leaders. We are delighted to have participated in this meaningful event to showcase our solutions for the future Chiplet Market. …

TSMC OIP conference 2023 Read More »

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet Applications to Achieve Compliance and High-Speed Connectivity Tewksbury, MA., June 21, 2022 Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP solution partner for eTopus PCIe Gen 1-6 …

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity Read More »

QuickLogic and eTopus Announce Disaggregated Flexible eFPGA Chiplet Template

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template Targeting advanced, high-performance applications | Available initially as configurable IP and later as Known Good Die chiplets SAN JOSE, Calif., June 16, 2022 QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader …

QuickLogic and eTopus Announce Disaggregated Flexible eFPGA Chiplet Template Read More »

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications Complete bench setup using Hirose mezzanine/card edge connectors and eTopus SerDes IP will be demonstrated at DesignCon in San Jose San Jose, Calif. – April 6, 2022 Hirose Electric Co., Ltd., a global leader in connector technology, its design, …

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications Read More »

Scroll to Top