Press Releases

eTopus announces partnership with YorChip for Low Latency 200G Chiplet. YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps. SAN RAMON, CA, USA, June 19, 2024 — YorChip, Inc. announces its first Chiplet details to empower edge AI developers. The Chiplet …

eTopus announces partnership with YorChip for Low Latency 200G Chiplet Read More »

SerDes clocking catered to robust noise handling in advanced process technologies for HPC, Datacenter, 5G and AI applications Find out how eTopus aids high-speed data center links needed to support a wide span of data rates and protocols, employing complex modulation schemes and varying insertion loss requirements from VSR at few dBs to LR at …

SerDes clocking catered to robust noise handling in advanced process technologies for HPC, Datacenter, 5G and AI applications Read More »

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet Applications to Achieve Compliance and High-Speed Connectivity Tewksbury, MA., June 21, 2022 Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP solution partner for eTopus PCIe Gen 1-6 …

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity Read More »

QuickLogic and eTopus Announce Disaggregated, Flexible eFPGA Chiplet Template Targeting advanced, high-performance applications | Available initially as configurable IP and later as Known Good Die chiplets SAN JOSE, Calif., June 16, 2022 QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, and eTopus, a leader …

QuickLogic and eTopus Announce Disaggregated Flexible eFPGA Chiplet Template Read More »

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications Complete bench setup using Hirose mezzanine/card edge connectors and eTopus SerDes IP will be demonstrated at DesignCon in San Jose San Jose, Calif. – April 6, 2022 Hirose Electric Co., Ltd., a global leader in connector technology, its design, …

Hirose and eTopus Technology Develop Combined PCIe Gen6 64Gbps PAM4 Interconnect Solution for AI Training Applications Read More »

eTopus Announces PCIe IP Gen 1-6 and 800G Support for 7/6nm with Support for SoC & Chiplet Clients San Jose, CA – Mar 29, 2022  eTopus Technology today announces the design-in availability of its 7/6nm multi-protocol SerDes IP optimized for PCIe Gen 1 to 6 SoC & Chiplet clients. This new IP also supports Ethernet …

eTopus Announces PCIe IP Gen 1-6 and 800G Support for 7/6nm with Support for SoC & Chiplet Clients Read More »

eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets Includes IPs such as SerDes, eFPGA, Ethernet MAC/PCS, Die2Die and RISC-V San Jose, CA – Feb 2, 2022 eTopus Technology today announced in partnership with QuickLogic and OpenFive, a platform of base IP that can be easily integrated by chiplet developers with minimal …

eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets Read More »

eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns San Jose, CA – October 19, 2021  eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications is proud to introduce its new 400G Long Range (LR) IP solution incorporating Forward Error Correction (FEC) IP and the eTopus DSP-based …

eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns Read More »

Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Sept 14, 2021  San Jose, CA, USA – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today …

Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions Read More »

eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Breakthrough Software and Methodology Enables Fast and Insightful IC Design Debugging and Optimization San Jose, CA – August 24, 2021  Diakopto announced today that eTopus, a pioneer of ultra-high speed ADC/DSP-based SerDes for wireline applications, has chosen the ParagonX platform and methodology for integrated circuits …

eTopus Selects Diakopto’s ParagonX™ Platform for Ultra-High Speed SerDes IP Read More »