Congratulations to eTopus Team Presenting at 2022 TSMC OIP

October 27, 2022

 

Thanks TSMC for organizing a very successful 2022 TSMC OIP Forum for semiconductor innovators to see and share the latest development from the technology leaders.

Our R&D team partnered with Siemens EDA team to highlight the experience of overcoming key design challenges for accurate data acquisition and clock recovery in high-speed connectivity design. Contact us directly to get a copy of the presentation.

Here are some snapshots of the event. Enjoy!

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